The XF1 set consists of four magnetic field probes and one E-field probe for measuring E-fields and magnetic fields from 30 MHz to 6 GHz on electronic assemblies during the development stage. Due to their integrated impedance matching, the probes are less sensitive in the lower frequency range than the RF-type probes. The probe heads of the XF1 set allow for the step by step localization of magnetic-field interference sources on assemblies. First the XF-R 400-1 probe is used to detect electromagnetic interference from greater distances. Next, the higher resolution probes can be used to more precisely detect the interference sources. The E-field probe is used for the detection of electric interference fields near the assemblies. With trained use of the near-field probes, field orientation and field distribution can be detected. The near-field probes are small and handy. They have a current attenuating sheath and, therefore, are electrically shielded. They can be connected to a spectrum analyzer or an oscilloscope with a 50 Ω input. They have an internal terminating resistance.
Scope of delivery
- 1x XF-B 3-1, H-Field Probe 30 MHz up to 6 GHz
- 1x XF-E 10, E-Field Probe 30 MHz up to 6 GHz
- 1x XF-R 3-1, H-Field Probe 30 MHz up to 6 GHz
- 1x XF-R 400-1, H-Field Probe 30 MHz up to 6 GHz
- 1x XF-U 2.5-1, H-Field Probe 30 MHz up to 6 GHz
- 1x SMA-SMA 1 m, SMA-SMA Measuring Cable
- 1x XF 1 qg, XF1 Set Quick Guide
- 1x Case 5, System Case Near-Field Probes
|Frequency range||30 MHz ... 6 GHz|
|Output resistance||50 Ω|
Scope of delivery details
The measurement coil of the XF-B 3-1 H-field probe is set at a 90° angle to the probe shaft. By positioning the probe head vertically, the measurement coil touches the surface of the printed circuit board directly. This allows for use at places on the surface of printed circuit boards, which are ty…
The electrode in the probe head of the XF-E 10 has a width of approx. 0.2 mm. With the probe even smallest E-field sources can be located, e.g. conducting paths with a width of 0.1 mm or single pins on multi pinned ICs. To measure, the E-field probe is positioned onto the object.
The XF-R 3-1 near-field probe is designed for direct high-resolution measurements of RF magnetic fields on an assembly, e.g. around the pins and IC cases, conducting paths, decoupling capacitor, and EMC components.
Due to its large diameter (25 mm) and its high resolution, the XF-R 400-1 H-field probe is suitable for measurements at distances up to 10 cm around assemblies and devices.
The XF-U 2.5-2 near-field probe is designed for the selective measurements of RF currents in conducting paths, component connectors, SMD components, and IC pins. The probe head has a magnetically active gap with an approx. width of 0.5 mm. To use, the head should be positioned directly onto the meas…