Measurement of magnetic or electric near fields with extremely high resolution and sensitivity on the chip surface of ICs, for example.
The dimensions of the near-field microprobe heads are in the micrometer range. Thanks to their measurement resolution they can thus be used to examine near fields on ICs (die surface, bond wires, pins). They move a few µm above the respective object to be measured and can detect H- and E-near fields separately at a high resolution.
- The near-field probes are no longer guided by hand but controlled by a manual or automated mover due to their high resolution and sensitivity.
- The H- or E-probe heads are fitted at the tip of the probes. An amplifier is integrated in the probe case.
- The probe holder can alternatively be adapted to the customer‘s existing mover or robot systems on request.
- Near-field microprobes can be delivered for a wide variety of measurement tasks that have to be carried out during development work. The portfolio of probe types thus allows the user to make an optimum choice for a wide range of practical measurement purposes.